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Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021
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Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021
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Flexible epoxy casting and potting system. An unfilled, semi-flexible epoxy casting system with long pot life. This product may be used in large mass casting. CLR 1180 / CLH 6520
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Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770
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Abrasion Resistant Epoxy. An abrasion resistant, two component epoxy surface coat. CLR 1710 / CLH 6710
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Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500
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Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182
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2:1 machine dispense adhesive. Bonding abrasive wheels and disks. A two component epoxy system suitable for potting, casting and adhesive applications. Product gels quickly and has good thermal cycling endurance. Material is filled with non-abrasive fillers making it suitable for machine dispensing. XRD 1575 / XH6 1418